1. Samsung is establishing advanced manufacturing facilities at its Hwaseong plant to enable mass production using a 2nm process. The company is also preparing to install equipment for a 1.4nm production line at its Pyeongtaek II plant.

    2. Intel and AMD will jointly establish an x86 ecosystem advisory group, which currently includes participants such as Google, Broadcom, Dell, HP, Lenovo, Microsoft, Meta, Oracle, and Red Hat.

    3. Japan's Shin-Etsu Chemical plans to expand its core electronic materials division and launch a semiconductor manufacturing equipment business.

    4. Qualcomm has launched its flagship mobile platform—Snapdragon 8 Elite (Snapdragon 8 Gen 2), built on a second-generation 3nm process, claiming it to be the fastest mobile system-on-chip in the world.

    5. Slkor Micro's Song Shiqiang and Xiong Wen's article on "Changsha Mito being classified as a 'fishing-style rights protection' by the Supreme People's Court" has gained significant attention online. Under mounting pressure from various media outlets, courts across the country have begun to reduce compensation for Mito victims or postpone hearings, leading to an improving situation for victims struggling to win their cases.

    6. Recently, at the 2024 World Intelligent Connected Vehicles Conference, Beijing Huixi Intelligent Information Technology Co., Ltd. officially launched its first high-end intelligent driving chip—Guangzhi R1.

China Semiconductor Industry Developments Highlights

    1. China has launched the world's largest 35 MW six-degree-of-freedom wind turbine test platform, which is now officially operational at the Sany Heavy Energy Wind Power Test Center.

    2. Hong Kong is establishing a HKD 10 billion "Innovation and Technology Industry Guidance Fund" to create a mother fund aimed at boosting strategic emerging and future industries, including artificial intelligence, robotics, semiconductors, and smart devices.

    3. The construction project for CRRC's low- and medium-voltage power devices in Yixing has officially completed after 18 months, with an initial investment of 5.9 billion yuan.

    4. An advanced semiconductor chip packaging and testing base and headquarters project will establish a new production line for advanced semiconductor power device chips, with a total investment of 5.2 billion yuan.

    5. Recently, the second phase of the Shanghai Semiconductor Equipment Materials Fund, with a total scale exceeding 2.1 billion yuan, successfully completed its second fundraising round.

    6. Baiwei Storage aims to raise 1.9 billion yuan, primarily targeting key areas such as wafer-level advanced packaging and testing and advanced testing for storage chips.

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