Semiconductor Industry Updates

1. The UK government has required the Chinese-invested entity Future Technology Devices International Holding Ltd to sell its 80.2% stake in the Scottish chip design company, FTDI.

2. The Biden administration in the U.S. is rushing to disburse more funds from the $53 billion allocated under the CHIPS Act before Trump potentially returns to office.

3. ESMC plans to begin construction of a semiconductor wafer fabrication plant in the second half of 2024, with an expected initial production phase by the end of 2027.

4. According to a new forecast from Gartner, IT spending in Europe is expected to reach $1.18 trillion by the end of 2024, and to grow by 8.5% to $1.28 trillion by 2025.

5. The Slkor Semiconductor company recently launched its app, further enhancing its operational efficiency and helping with brand promotion.

6. Onsemi (Chinese Ansemi) announced that its Hyperlux LP image sensor won the 2024 Global Electronics Achievement Award in the Sensor Category for Innovative Product of the Year, awarded by AspenCore Media Group.

China Semiconductor Industry Updates

1. The Zhuzhou Bar Association in Hunan has officially launched an investigation into the Longan Law Firm and its lawyer Gui Luyun for allegedly colluding with MiTuo from Changsha to extort and coerce small and medium-sized enterprises. Slkor Semiconductor’s Song Shiqiang has called on tens of thousands of victims to file complaints with the Rights Protection Department of the Changsha Bar Association regarding the fraudulent practices of lawyers Yang Haijun, Liu Bo, and Lin Li (located at 23rd Floor, Twin Towers International Plaza, 258 Yuhua Zhong Road, Changsha / 0731-85408110).

2. Dongfeng Motor Corporation has led the release of China’s first domestically developed, high-performance, automotive-grade MCU chip, DF30, based on the self-developed, open-source RISC-V multi-core architecture.

3. SMIC (Semiconductor Manufacturing International Corporation) has issued a warning that the overcapacity problem in mature semiconductor processes will persist until 2025, and the company will be more cautious about expanding new capacity.

4. Taiwan Semiconductor Manufacturing Company (TSMC) has announced the construction of three semiconductor fabs in Arizona, U.S., with planned completion and operation dates in early 2025, 2028, and 2030.

5. The Chengdu Economic and Information Technology Bureau has released the list of projects to be supported for the 2024 Chengdu Integrated Circuit Initiative, with 69 units and 109 projects to be supported.

6. Jiangbolong's two self-developed main control chips, the WM6000 and WM5000, have already been mass-produced and have surpassed the shipment of over 10 million units.

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