International News

1. Singapore's government has set a target to achieve a 50% enhancement in its semiconductor-dominated manufacturing industry by 2030. Several major chip manufacturers are ramping up investments and increasing production capacities.

2. The European Union is heavily investing in initiatives to achieve chip independence using the RISC-V open-source architecture. This effort is spearheaded by the Barcelona Supercomputing Center.

3. The United States unveiled a 165-page draft proposal on the 21st, proposing restrictions or requirements on Chinese investments in AI and other technology sectors. Investment restrictions could come into effect by the end of this year.

4. In the first quarter of 2024, Huawei's smartphone sales in mainland China surged by 70%, reclaiming the top spot in the market with a 17% share, after 13 quarters.

5. Kinghelm (www.kinghelm.net) and SlkorMicro's General Manager, Song Shiqiang, released "In-depth Research on Huaqiangbei by Song Shiqiang," outlining 19 systematic, professional, and in-depth points about Huaqiangbei.

6. Japan announced a new round of sanctions against "individuals and groups supporting Russia in the Russia-Ukraine conflict." Reports indicate that sanctioned Chinese enterprises "provided drone chips to Russia."

China News

1. On June 21st, the Ministry of Industry and Information Technology (MIIT) released the "2024 Automotive Standardization Work Points," emphasizing the strengthening of automotive chip standard supply. Core component automotive chips are expected to enter a period of rapid development.

2. The 2024 Computational Power Technology Innovation and Development Ecological Summit will officially be held at the C1 Hall, Booth 1574, Shanghai New International Expo Center forum area on July 8th.

3. On June 21st, the Jiangsu Integrated Circuit (Wuxi) Industry Special Fund was launched in Wuxi with a total scale of 5 billion yuan.

4. According to a report by the China Industrial Research Institute, the market size of China's automotive chip market is projected to reach 90.54 billion yuan in 2024.

5. SMIC intends to acquire the remaining 72.33% equity of its subsidiary, SMIC Jiangsu, which will become a wholly-owned subsidiary, contributing to the leadership in China's power semiconductor industry innovation.

6. TSMC is researching a new advanced chip packaging method using rectangular panel-like substrates instead of traditional round wafers, allowing more chips to be placed on a single substrate.