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Home -News -Latest News -The 2024 (5th) Global MCU and Embedded Ecosystem Development Conference is about to commence

The 2024 (5th) Global MCU and Embedded Ecosystem Development Conference is about to commence

Release date:2024-07-20Author source:KinghelmViews:1144

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From Song Shiqiang's social media circle

 

International News

1.ASML's financial report for the second quarter of 2024 shows promising results: net sales of 6.243 billion euros, an 18.0% increase quarter-over-quarter; gross margin of 51.5%; net profit of 1.578 billion euros, up by 28.9%.

2.GlobalWafers America (GWA) and MEMC LLC, subsidiaries under GlobalWafers, have signed a preliminary memorandum with the U.S. Department of Commerce under the Chip Act, entitling them to receive up to $400 million in direct subsidies.

3.The 2024 (5th) Global MCU and Embedded Ecosystem Development Conference, organized by AspenCore, will be held on July 25th at the 2nd floor of the Shenzhen Jun Yue Hotel.

4.As of early July this year, Huawei's Intelligent Automotive Solutions Business Unit has achieved revenues of 10 billion yuan, marking a doubling in growth!

5.Kinghelm (www.kinghelm.net) and SlkorMicro's summer interns collectively visited the Kinghelm factory and its smart warehouse, gaining insights into the factory's production processes and warehouse management.

6.Alphabet, Google's parent company, is planning a approximately $23 billion acquisition of cybersecurity startup Wiz. If successful, this would be Alphabet's largest acquisition in history.

 

China News

1.Recently, the Computer School of Beihang University successfully taped out two processors, Lain and EULA, based on LoongArch architecture from Loongson Technology.

2.TSMC Chairman and CEO Wei Zhejia proposed "Foundry 2.0," which includes packaging, testing, and other IDM-related industries, expecting the semiconductor foundry industry to grow by 10% this year under this definition.

3.On July 18th, China Automotive Technology and Research Center signed a strategic cooperation agreement with the Lingang New Area Management Committee, unveiling the first automotive data cross-border innovation center in China.

4.Beijing University of Science and Technology signed a strategic cooperation agreement with Tsinghua Unigroup to focus on advanced process integrated circuit foresight technology and key core technology research, initiating comprehensive cooperation.

5.BYD plans to establish its second production base in Southeast Asia—a electric vehicle assembly plant in Cambodia—welcomed by Cambodian Prime Minister Hun Sen.

6.Visionox Technology plans to invest 500 million yuan in a comprehensive capacity upgrade and technological transformation project for its MicroOLED production facility.

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