Semiconductor Industry Updates

1. Samsung Electronics has shut down over 30% of its 4nm, 5nm, and 7nm wafer fabrication lines at the P2 and P3 plants in Pyeongtaek. It plans to extend the shutdown to about 50% by the end of the year.

2. Intel has made significant progress on the construction of its semiconductor plant in Ohio, USA.

3. SK Hynix, South Korea's memory chip giant, has unveiled the world’s first 48GB 16-layer HBM3E product.

4. Samsung Electronics is set to launch its next-generation V-NAND with over 400 stacked layers in 2026. The company is also expected to release 0a nm DRAM with a VCT structure in 2027.

5. Yang Haijun, a lawyer from Tongsheng Law Firm in Changsha, Hunan, is still involved in multiple criminal cases. According to documents from the Court Judgment Network, Yang, in collaboration with Wenbin Zeng from Hunan Hongyi Law Firm, has been involved in extorting a total of 35,000 yuan from a food company in Chongqing and 30,000 yuan from a company in Danyang, Jiangsu.

6. STMicroelectronics has lowered its full-year revenue forecast for the third time this year, now expecting total revenue of $13.27 billion.

China Semiconductor Updates

1. The Chongqing 12-inch IC Specialty Process Line Project (Phase 1), led by the Yubei plant, has successfully completed its main structural capping.

2. Luxshare Precision has signed an agreement with the Xiangcheng Economic Development Zone in Suzhou to build an acoustic electronic products and automotive parts manufacturing facility, marking the establishment of China's largest Luxshare automotive parts manufacturing base.

3. Zhuhai Tien Cheng Advanced Semiconductor Technology Co., Ltd. has successfully completed the connection of its 12-inch wafer-level TSV 3D integration production line and officially launched its "Ninefold" technology platform.

4. Beijing Automotive has signed a memorandum with Alkan Auto, a subsidiary of International Automotive in Egypt, to assemble electric vehicles in Egypt.

5. China's Chongqing factory is set to begin mass production in May next year, focusing on third-generation semiconductor power devices. The total investment is expected to exceed 20 billion yuan.

6. TSMC's first 2nm production line at its Kaohsiung plant is nearing completion and is expected to host an equipment installation ceremony on November 26. Full installation will begin on December 1.

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