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Home -News -Latest News -Germany may become the landing point for two major semiconductor factory projects in Europe.

Germany may become the landing point for two major semiconductor factory projects in Europe.

Release date:2024-05-20Author source:KinghelmViews:1593


International News:

1. In the first quarter of this year, global cumulative sales of electric vehicles reached 3,216,366 units, with a year-on-year increase of over 25% and a market share rising to 16%.


2. The European Union has launched a $46.3 billion plan aimed at expanding Europe's domestic semiconductor manufacturing capacity.


3. Germany may become the landing point for two major semiconductor factory projects in Europe: Intel's wafer fab in Magdeburg and TSMC's wafer fab in Dresden.


4. Microsoft China's AI research teams, such as the C+AI team and the Azure ML team focusing on AI platforms, are being relocated to the United States or Australia.


5. On May 18th, Kinghelm (www.kinghelm.net) and SlkorMicro General Manager Song Shiqiang were invited to attend Longwei Business Software's 18th anniversary celebration and the Xinchuhai Forum.


China News:

1. On May 15th, the topping-out ceremony for the first phase of the Wuyuan Semiconductor project's production plant was held in Chengyang District, Qingdao, with a total investment of 2.37 billion yuan.


2. On May 15th, the 2024 Yangzhou · Jiangdu First Semiconductor Industry Development Conference was held, and 12 projects were signed on-site.


3. On May 15th, Guochuangxin Technology (Jiangsu) Co., Ltd. opened in the Economic Development Zone. This is a wholly-owned subsidiary established by Hefei Datang Storage Technology Co., Ltd. in Yangzhou.


4. On May 16th, the Huahai Qingke Integrated Circuit Equipment Research and Development Manufacturing Base project was signed and settled in Lingang.


5. Qinyi Optoelectronics has achieved mass production of 180nm process node semiconductor chip photomasks and is advancing the development plan for photomasks required for 28nm semiconductor chips.


6. MediaTek is deeply involved in the architecture design of Armv9's next-generation IP "Black Hawk" and is expected to apply it to the upcoming Dimensity 9400 chip.


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