International News

1. During the 9th trilateral summit among China, Japan, and South Korea, Premier Li Keqiang of the State Council met with Lee Jae-yong, Chairman of South Korea's Samsung Group, who expressed their commitment to becoming a beloved enterprise by the Chinese people.

2. On May 28th, NVIDIA's stock price surged by nearly 7%, once again setting a historic high with a market capitalization exceeding $2.8 trillion, approaching Apple's market capitalization of $2.9 trillion by only about $100 billion.

3. As of May 2024, the list of the top ten companies in global research and development (R&D) investment has been released, with only one Chinese company, Huawei, making the list, ranking seventh with an R&D investment of $23.5 billion.

4. On May 30th, chip design company Arm announced the release of new CPU and GPU IP based on 3nm chip technology.

5. On May 30th, articles titled "On Enterprise Management Efficiency by Song Shiqiang (Part II)" were published on the official websites of Kinghelm (www.kinghelm.net) and SlkorMicro, and were subsequently shared by multiple media outlets.

6. The Nuclear Safety and Security Commission (NSSC) of South Korea stated on the 29th that it is investigating an incident where two employees at Samsung Electronics' Giheung plant suffered radiation exposure on May 27th.

China News

1. China may invest approximately 6 billion yuan in research and development of solid-state batteries, with six companies including CATL, BYD, FAW, and SAIC potentially receiving government support for basic research and development.

2. The 6th Shenzhen Semiconductor Industry Technology Summit will be held on June 26th at the Shenzhen International Convention and Exhibition Center (Baoan New Hall) Hall 8.

3. Analysts from the China Industrial Research Institute predict that the Chinese sensor market will reach 332.49 billion yuan in 2023 and 373.27 billion yuan in 2024.

4. BYD has unveiled its fifth-generation DM technology, featuring integrated chipsets, VCU, dual MCUs, and triple-brain integration, resulting in a 146% increase in chip computational power.

5. The first phase of the high-end substrate project for integrated circuit packaging by Chip Love Technology (Nanjing) has been completed and accepted, with a total investment of 4.5 billion yuan and an estimated annual production capacity of 1.45 million units.

6. The semiconductor industry is continuously exploring new materials and advanced manufacturing technologies, with silicon carbide (SiC) from Slkor being a third-generation semiconductor material and currently the most advanced.