International Tech New:

1. China's chip exports have reached a milestone. In the first 11 months of this year, China's integrated circuit exports reached 1.03 trillion yuan, exceeding one trillion yuan for the first time, with a year-on-year growth of 20.3%.

2. The Chinese Ministry of Foreign Affairs has decided to take countermeasures against U.S. military enterprises and their senior management personnel, involving 13 companies such as Teledyne Brown Engineering and BRINC Drones.

3. The Ministry of Economy, Trade and Industry of Japan will provide subsidies for the silicon carbide (SiC) semiconductor project jointly invested by Denso and Fuji Electric. The maximum subsidy amount is up to 70.5 billion yen (approximately equivalent to 3.4 billion yuan).

4. Vishay Intertechnology Inc. will invest 51 million pounds in the Newport Wafer Fab wafer factory located in Wales, UK. This investment has received a subsidy of 5 million pounds from the Welsh government.

5. On the afternoon of December 11th, Song Shiqiang of Slkor (www.slkormicro.com) and Lu Yong of Tanjingke had a live discussion with Murong Sujuan, the editor-in-chief of "Big Talk on Chips", on the topic of "The Escalation of the Sino-US Tech War, the Crisis and Responses of China's Chip Industry". They unanimously believed that opportunities outweigh risks and that it's okay to just do daily work with a normal mindset.

6. Mitsubishi Electric Group will invest approximately 10 billion yen (approximately equivalent to 480 million yuan) to build a new power semiconductor module packaging and testing factory in Fukuoka Prefecture, Japan. It is expected to start operation in October 2026.

Domestic Tech New:

1. The "National Anti-Phishing Rights Protection Alliance" has gained another powerful member. Yang Chunlei, the person in charge of the video account "Uncle Er Has Been Moving Bricks for Twenty Years", will continue to expose the fraud and extortion methods of Changsha Mituo through short videos, calling on the victims not to settle and pay money but to persist in filing protests and reporting the case in court.

2. TSMC's sales in November this year were NT$276.06 billion, with a year-on-year growth of 34%. Analysts from institutions said that the booming demand for AI in the market will drive up TSMC's gross profit margin.

3. The 2024 Slkor (www.slkoric.com) Agents Conference was held at the headquarters of Kinghelm/Slkor on December 12th. Many high-quality agents were invited to participate in this grand event.

4. The J2C workshop of the 3D multi-chip integrated packaging project of SJ Semiconductor Corporation has been successfully topped out.

5. The first phase of the high-end packaging substrate and high-end HDI production capacity construction project of Amkor Technology (Xiamen) Co., Ltd. has been completed and put into trial operation. The total planned investment for the project is 7.38 billion yuan, which will be constructed in two phases.

6. TSMC is expected to certify the super-large version of the CoWoS (Chip-on-Wafer-on-Substrate) packaging technology in 2027. This technology will provide an interposer size of up to 9 mask sizes and 12 HBM4 memory stacks. It is speculated that it will be adopted by ultra-high-end AI processors from 2027 to 2028.

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