International News

1. On June 2nd, Nvidia announced that it will launch the Blackwell Ultra AI chip in 2025 and revealed the name of its next-generation AI platform, "Rubin," which will be released in 2026.

2. Samsung Electronics is exploring "hafnium-based ferroelectric" as the next-generation material for NAND flash memory. It plans to stack over 1,000 layers of 3D NAND by around 2030.

3. The Semiconductor Wafer Test 2024 Conference was held in California, USA from June 3rd to 5th. This conference focused on microelectronic wafer and chip-level testing, including 23 semiconductor technology speeches.

4. Microsoft plans to invest $3.2 billion in Sweden to build a data center focusing on artificial intelligence (AI) and cloud services.

5. "How AI Empowers New Quality Productivity," an article written by Song Shiqiang, was published on Kinghelm and SlkorMicro's official website, and was reprinted by multiple media outlets such as Xinhua Liaowang.

6. Yesty, a South Korean semiconductor equipment manufacturer, announced that it has received orders worth KRW 6 billion (approximately USD 4.35 million) from Samsung Electronics for high-bandwidth memory (HBM) compression and atmospheric pressure equipment.

China News

1. On May 31st, the management committee of Texas Tianqu New District signed an investment agreement with Guangdong Xianfeng Rare Materials for the industrialization project of semiconductor lidar and sensor components, which officially settled in the new district.

2. On May 30th, Guangdong Xincheng Hanqi Semiconductor successfully won the Songshan Lake Eco-Industrial Park 2024WT038 plot, intended for the advanced wafer-level packaging and testing manufacturing project, with a total investment of approximately RMB 3.09 billion.

3. The signing and unveiling ceremony of the Semiconductor Material Joint Laboratory jointly established by the Sino-Singapore International Joint Research Institute and Guangzhou Micronano Silicon Material Co., Ltd. was held at the research institute on May 30th.

4. United Microelectronics Corporation (UMC) is actively developing the 12nm FinFET process technology platform (12FFC), which can be widely used in various semiconductor products and is expected to be developed by 2026 and put into production in 2027.

5. The Zhangjiang Chip Testing Public Service Platform is about to be launched. The platform is jointly built by Zhangjiang High-tech and Hualing, and will accelerate the speed of chip design to mass production.

6. On May 28th, TSMC passed the plan to spin off its 8-inch GaN (gallium nitride) business, which will be taken over by its subsidiary, Guanya Semiconductor.