Kinghelm and Slkor Wish the people of the whole country a safe and healthy Dragon Boat Festival

International News

1. The South Korean government is currently reviewing policies to support the manufacturing of key materials, components, and equipment for HBM chips, potentially including tax incentives, to strengthen its leading position in the global semiconductor industry.

2. The semiconductor manufacturer Rapidus in Japan has commenced construction of its Hokkaido wafer factory, with plans to start trial production of 2-nanometer AI chips in 2025 and full-scale production in 2027.

3. World Advanced and NXP Semiconductors will jointly establish a 12-inch semiconductor wafer manufacturing facility in Singapore, with a total investment of $7.8 billion. The factory is set to commence mass production in 2027.

4. Nvidia will continue to expand its presence in Taiwan, China, with intentions to establish a research and development center within five years and plans to establish a second AI supercomputer center similar to Taipei-1.

5. Kinghelm (www.kinghelm.net) released an article titled "Why Are There So Many Billionaires in Huaqiangbei, Shenzhen?," on its official WeChat account "Kinghelm Connect World."

6. SK Hynix will strengthen its collaboration with TSMC in the high-bandwidth memory (HBM) field to enhance the competitiveness of AI semiconductors.

China News

1. On June 6th, the topping-out ceremony for the new factory and supporting facilities of Jiangsu Lusin Semiconductor Company was successfully held, with a planned investment of 2 billion yuan, aiming to address the domestic shortage of high-end chips.

2. On June 6th, the topping-out ceremony for the domestic semiconductor process equipment and key components project of Shengjian Environment was held, with a total estimated investment of 600 million yuan.

3. Recently, the Beijing Integrated Circuit Industry-Education Integration Base project has entered a new stage of above-ground steel structure construction, expected to be put into use in September 2025.

4. The China-Singapore Semiconductor Industry Fund project has officially signed, with a target total scale of 1.001 billion yuan, primarily focusing on investments in the upstream and downstream of the packaging industry chain.

5. On June 5th, the Xingan Technology third-generation semiconductor power module R&D and production base project was signed and settled in Xidong New City, with a total investment exceeding 1 billion yuan and expected production commencement in 2025.

6. On June 7th, Alibaba's Qwen2 large model was officially released, covering five sizes of pre-training and instruction fine-tuning models, with a maximum context length of up to 128K tokens.