International News
1. John Neuffer, President and CEO of SIA, has issued a statement urging the House of Representatives to pass the American Chips Act (S.2228).

2. Infineon has successfully developed the world’s first 300mm gallium nitride (GaN) power semiconductor wafer technology.

3. Vietnamese company Tasco has signed an agreement with Geely Auto Group from China to establish a joint venture for an automotive assembly plant in Tay Ninh Province, with a projected total investment of approximately $168 million.

4. The U.S. Department of Energy announced over $3 billion in funding for 25 selected projects across 14 states to promote the domestic production of more advanced batteries and battery materials.

5. Slkor Semiconductor has seen widespread online sharing of an article by Song Shiqiang revealing how "black lawyers" Yang Haijun and Zhang Yuanyuan manipulated illegal activities surrounding Chengdu Mitou. The Mitou gang is reportedly in a state of panic, spending money to delete posts continuously!

6. The 2024 Shenzhen Sichuan-Chongqing Basketball League, co-hosted by Kinghelm Electronics, successfully concluded, with the Sichuan-Chongqing Youth Team winning third place and the middle-aged team taking fourth. The Xichong Business Association Basketball Team received the award for best organization!

China News
1. New Storage Technology (Wuhan) Co., Ltd. has attracted significant attention in China’s tech community by officially launching the country’s first large-capacity new-type 3D memory chip, the NM101.

2. The "Safety Performance Inspection Regulations for New Energy Vehicles" (GB/T 44500-2024) have been released and will take effect on March 1, 2025. Key focuses of the new regulations will include battery and electrical safety during annual inspections.

3. The Ministry of Commerce has decided to launch an anti-discrimination investigation starting September 26, 2024, in response to Canada’s plans to impose additional tariffs on electric vehicles and steel and aluminum products imported from China.

4. The second phase of the Huatiannanjing Integrated Circuit Advanced Packaging and Testing Industrial Base has begun construction in the Pukou District, with an investment of 10 billion yuan. Upon reaching full production, it is expected to achieve an annual output value of 6 billion yuan.

5. Xinggan Technology has successfully completed the first batch of wafer production, marking the official commencement of full operations at its wafer factory.

6. The groundbreaking ceremony for the Tongfu Tongda Advanced Packaging Base Project was held in the Shibei High-tech Zone, with a total investment of 7.5 billion yuan, and plans for full production by April 2029.

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