International Tech New:

1. It is reported that Toshiba will lay off more than 3,000 employees in Japan.

2. It is learned that AMD intends to enter the field of mobile phone chips. Relevant new products will be manufactured using TSMC's 3nm process.

3. The German government plans to provide new subsidies worth several billion euros to the German semiconductor industry.

4. Vishay will invest 51 million pounds in the Newport Wafer Fab it acquired.

5. According to Deputy Minister of the Russian Federation Ministry of Industry and Trade Shpak, Russia has already received the first batch of its self-developed 48-core processor chips named "Baikal".

6. Song Shiqiang from SLKORMicro (www.slkormicro.com) called on Judge Yu Xiaohan of the Supreme People's Court to completely correct the wrong precedents in the Changsha Mituo fishing lawsuit case in the past, adjust the guiding opinions for the judgments of grassroots courts, and prevent the people's courts from continuing to become accomplices in the development of the intellectual property rights extortion industry chain!

Domestic Tech New:

1. The J2C plant of the 3D multi-chip integrated packaging project of SJ Semiconductor has been successfully topped out.

2. The 12-inch lightly doped BCD silicon wafers produced by Zing Semiconductor have achieved a technological breakthrough. The yield has reached the advanced level in the industry, passed the verification of domestic and foreign customers, and has already achieved large-scale mass production.

3. On the afternoon of November 29th, He Junju, the deputy general manager of SLKORMicro, attended the 25th anniversary celebration of IC Trade Net. At the event site, SLKORMicro Semiconductor was awarded the title of "2024 Annual Advantage Brand Star" by IC Trade Net.

4. The self-developed chip DeepEdge 10 by Intellifusion is a domestically pioneered 14nm Chiplet inference chip for large models in China, which can support the operations of large models at the ten-billion level.

5. TSMC will launch an oversized version of CoWoS packaging with 9 mask sizes in 2027, which can accommodate 12 HBM4 stacks.

6. Lianyun Technology, a major domestic manufacturer of storage master control chips, has been successfully listed on the Science and Technology Innovation Board of the Shanghai Stock Exchange.

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