1. Samsung Accelerates HBM Investment, Expands Packaging Capacity at Suzhou Plant.

2. Japanese Manufacturer Kioxia Receives Approval for Tokyo Stock Exchange IPO, to List on the TSE Prime Market on December 18, with an Estimated Market Value of ¥750 Billion.

3. The U.S. Allocates $285 Million to Build Semiconductor Digital Twin Center.

4. The U.S. CHIPS Act Allocates $300 Million to Support Advanced Packaging Projects in Georgia, California, and Arizona.

5. Israeli Semiconductor Foundry Tower Semiconductor Announces Mass Production of Its Latest Silicon Photonics Platform with 1.6 Tbps Optical Transceivers.

6. Changsha's Mitou Lawsuit Extortion Gang Faces Legal Action, With Victims Reporting to Authorities During Court Hearings.

China Tech & Market Updates：

1. Amid U.S. GPU Export Restrictions, Hong Kong's PC Partner Reportedly Plans to Relocate to Singapore and Establish PC Partner Singapore PTE Ltd.

2. China’s Foundry Industry Expands: From January to October, South Korea’s Exports of Blank Semiconductor Masks to China Totaled $16.96 Million.

3. Saco Microelectronics Tops Lichuang Mall’s Authorized Distributor Ranking, Competing with Global Brands Like Nexperia, ON Semiconductor, Panasonic, and Broadcom.

4. NAXIN Microelectronics Partners with Xinxian Semiconductor to Launch the NS800RT Series Real-Time Control MCU.

5. BYD Responds to False Investment and Partnership Claims Related to NIO.

6. Meizu and Shenzhen Tong Launch Pilot of UWB-Based Contactless Secure Payment Technology, Ushering in a New Era of Seamless Payments.

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