Service hotline
+86 0755-83975897
Release date:2024-08-16Author source:KinghelmViews:1059
Source: Photo from the WeChat Moments of Song Shiqiang, General Manager of SLKOR
International News
1. According to Korean media reports, SK Hynix has initiated an expansion of its M16 wafer fab, aiming to increase the company's DRAM memory production capacity by approximately 18%.
2. Google has launched Gemini Live, opening it first to English-speaking subscribers of Gemini Advanced, ushering in a new era of AI voice chat.
3. Samsung and LG have unveiled new organic light-emitting diode (OLED) display technologies.
4. GaN-on-SiC epitaxial manufacturer SweGaN has announced that silicon carbide-based gallium nitride wafers will begin shipping from its new plant, primarily for high-power RF applications in next-generation 5G advanced networks.
5. DigiKey expanded its supplier product offerings in the first half of 2014, introducing over 340,000 innovative new products, including 90,000 new stock parts available for sale.
6. Cisco Systems, the world's largest computer networking equipment manufacturer, is laying off 6,300 employees globally, with severance costs totaling up to $1 billion.
China News
1. TaiLing Microelectronics recently achieved a significant milestone, with the global cumulative shipment of its chips surpassing 2 billion units.
2. Shenzhen has announced ten major artificial intelligence hubs, including Longgang Bantian, Xili-Shiyan, Futian, Longhua Central Axis, Luohu Qingshuihe, Pingshan High-Tech Zone, and Guangming Science City.
3. SLKOR(www.slkoric.com) and Kinghelm's "Star of the Week" is Kinghelm Sales Manager Li Shaoshuai, who is awarded RMB 200.
4. Xiaomi's SU7 has been named the 2024 China Automotive Low Carbon Leader Model—Champion of the C-Class Pure Electric Sedan category.
5. Arctic Semiconductor’s self-developed 935 series chiplets have completed wafer fabrication and have successfully launched two heavy-duty products: the "Qiming 935" general-purpose HUB Chiplet and the "Big Bear Constellation" AI Chiplet, designed specifically for Transformer architecture.
6. Huayu Electronics has officially commenced production of the PMC 2030 (C-MOLD) encapsulation equipment.
Disclaimer: The information above is sourced entirely from the internet and does not represent the views of this account. If there are any infringements or objections, please contact us for removal.
Copyright © Shenzhen Kinghelm Electronics Co., Ltd. all rights reservedYue ICP Bei No. 17113853