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Home -News -Latest Tech News -Japan Invests in Rapidus for 2nm Chips Amid Soaring Global Semiconductor Market Growth

Japan Invests in Rapidus for 2nm Chips Amid Soaring Global Semiconductor Market Growth

Release date:2024-10-15Author source:KinghelmViews:698

Global Semiconductor Industry Developments Highlights

1. The Japanese government is considering investing in the semiconductor foundry Rapidus, which aims to begin mass production of 2nm chips by 2027.

2. The 2025 International Conference on Integrated Circuit Science and Technology (CSTIC 2025) will be held in Shanghai on March 24-25 next year. The event will cover all areas of semiconductor technology, including emerging semiconductor technologies.

3. This year, the global semiconductor market is expected to grow by 15-20%, reaching a market size of $600 billion. This growth is projected to help the semiconductor industry achieve the $1 trillion milestone by around 2030.

4. From 2025 to 2027, global spending on 300mm wafer fabrication equipment is anticipated to reach a record $400 billion.

5. From October 16-18, Kinghelm Electronics and SLKOR will showcase their products at the first "SEMiBAY" Bay Area Semiconductor Industry Ecosystem Expo. The event will take place at the Shenzhen Convention and Exhibition Center (Futian), booth number 1Q01. Everyone is welcome to visit and engage!

6. AMD recently held a product launch event, announcing that its latest AI chip, the Instinct MI325X, will start mass production by the end of the year.

China Semiconductor Industry Developments Highlights

1. In Changsha, a case of extortion involving over 2 million yuan has been described by the Supreme People's Court's Intellectual Property Division as the last desperate act of "fishing for rights."

2. Tianshui Huatian Technology Co., Ltd. has launched an upgrade project for its automotive electronics production line, with an investment of 4.8 billion yuan.

3. A signing ceremony was held for Zhejiang Leap Motor, which secured four industrial projects: a production base for new energy vehicle battery packs, an automotive electrical module production base, a vehicle lighting production base, and a new energy vehicle drive project.

4. The advanced packaging and testing project by Nantong Tongfu has officially commenced. Once completed, it will introduce top-notch packaging and testing technologies and equipment, with products widely used in high-performance computing, artificial intelligence, and other fields.

5. Jingwang Electronics held a groundbreaking ceremony for its factory in Thailand, which is aimed at providing high-quality products to international clients in the automotive electronics, network communication, server and storage, and communication module sectors.

6. In the first three quarters of 2024, China's exports of electromechanical products reached 11.03 trillion yuan, a growth of 8%, accounting for 59.3% of the total export value. Among these, integrated circuits saw a growth of 22%.

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