International News:

1. The Semiconductor Industry Association (SIA) of the United States announced that the global semiconductor sales totaled $137.7 billion in the first quarter of 2024, with a year-on-year increase of 15.2% but a sequential decrease of 5.7%. Sales for March decreased by 0.6% compared to the previous year.

2. Intel, in collaboration with 14 Japanese firms including Omron, plans to advance backend process automation, aiming for practical implementation by 2028.

3. Microsoft is developing a new AI mega-model named MAI-1, which is expected to have a parameter scale exceeding 500 billion.

4. On May 6th, Xilinx announced the sale of its SIG business, with the total transaction value reaching $2.1 billion.

5. Microsoft will host the Build 2024 developer conference in Seattle from May 21st to 23rd.

6. In the automotive cloud infrastructure market, public clouds hold a 59% share, with Alibaba Cloud capturing 34.5%, maintaining its leading position.

7. SoftBank Group is in negotiations to acquire the UK-based AI chip company, Graphcore.

8. On April 29th, Kinghelm Electronics (www.kinghelm.net) and Slkor Semiconductor achieved record-breaking single-day revenues, surpassing the TOP1 record of daily revenue in nearly two years. Another new record was set with a single transaction revenue reaching 540,000 yuan! On April 30th, General Manager Mr. Song Shiqiang arranged for the Finance Department to distribute bonuses to all employees, with bonus amounts ranging from 500 yuan to 4000 yuan based on colleagues' length of service, contribution, and professionalism.

China News:

1. Recently, the Wuhan Changfei Advanced Semiconductor Base project, China's largest SIC power semiconductor manufacturing base, successfully completed the first truss hoisting. The project is located in Wuhan, Hubei Province.

2. The first phase of the Henan Zhongyi Chuangxin Silicon Carbide Semiconductor Powder 500-ton production line project has successfully commenced production.

3. The second-phase expansion project of Jiangsu Tianke Heda's silicon carbide chip production is expected to commence operation in June this year.

4. On May 4th, the construction of the Hebei Huici Electronics High-Precision Electronic Ceramic Industrialization Project started in Zanhuang Economic Development Zone, Hebei Province.

5. On May 8th, the groundbreaking ceremony for the Shizuishan Smart Manufacturing Incubation Park project, with an annual output of 600,000 pieces of 8-inch new energy semiconductor wafers, took place.

6. Recently, the first "S Fund" in Sichuan was established in Chengdu with a total scale of 1.5 billion yuan, aiming to fully support the growth and development of local technology enterprises in Chengdu.

7. Recently, the inauguration ceremony and groundbreaking of the new location for Shenzhen Huali Yu High-end Chip Testing Base were held, marking a new milestone.