International News

1. Intel has suspended its $25 billion factory investment plan in Israel, citing commercial conditions, market dynamics, and responsible capital management as the reasons for its decision.

2. SK Hynix will strengthen its collaboration with TSMC in the high-bandwidth memory (HBM) sector, planning to start mass production of HBM4 by 2025.

3. South Korea's semiconductor exports increased by 36.6% year-on-year in the first ten days of June, with monthly export volumes maintaining double-digit growth for seven consecutive months.

4. Xiaomi's first vertically folding smartphone will feature the Qualcomm Snapdragon 8 Gen 3 flagship chip.

5. An article by Song Shiqiang, General Manager of Kinghelm (www.kinghelm.net) and SlkorMicro, discussing new qualitative productivity, was published in the English version on Yahoo Finance and appeared alongside Apple's Tim Cook.

6. Arm CEO Rene Haas predicts that System-on-Chips (SoCs) based on Arm CPU architecture will surpass x86 architecture in the Windows PC market by 2029.

China News

1. Domestic front-end coating and developing equipment will enter the OCF international supply chain for the first time, marking a "zero breakthrough" in the localization of visual chip color photoresist coating process equipment.

2. TSMC's wafer foundry in Germany, the European Semiconductor Manufacturing Company (ESMC), plans to recruit nearly 2,000 employees over the next 3 to 5 years to accelerate the construction and cooperation process.

3. Recently, Zhongke Tongliang announced that it has completed compatibility testing and certification with domestic innovative chips from multiple architectures including RISC-V, ARM, and x86.

4. Recently, a signing ceremony was held for the establishment of the Xiamen Advanced Manufacturing Fund, with a total scale of 10 billion yuan, which will support the doubled development of advanced manufacturing.

5. The Jiangsu Luxin Semiconductor project plans to invest 2 billion yuan, aiming to achieve an annual production capacity of approximately 35,000 semiconductor masks with a technology node of 28nm once completed.

6. On June 6, Shengjian Environmental held a topping-off ceremony for its domestically produced semiconductor process auxiliary equipment and key components project, with a total investment of 600 million yuan.