International News

1. Intel announced an agreement with Apollo to sell 49% of its stake in the joint venture of Fab 34 factory in Ireland for $11 billion.

2. imec and ASML announced the establishment of a joint High-NA EUV lithography laboratory in Veldhoven, the Netherlands, to be operated jointly by ASML and imec.

3. The World Semiconductor Trade Statistics Organization (WSTS) has revised its forecast for the spring of 2024, projecting a 16.0% annual growth in the global semiconductor market. The revised market valuation for 2024 is $6.11 trillion.

4. Mitsubishi Electric's SiC wafer plant in Kumamoto Prefecture will commence operations ahead of schedule, with the operational start date changed from April 2026 to November 2025, advancing by approximately 5 months.

5. Kinghelm's official WeChat account "Kinghelm Connects World" released an article titled "The Empowerment of New Productivity by AI (Artificial Intelligence)" by Song Shiqiang.

6. The topping-out ceremony for the main project of Malaysia's Fulhua Power Semiconductor Ceramic Substrate Project was successfully held.

China News

1. Beijing Mingja Semiconductor has achieved a new breakthrough in the development and industrialization of wide bandgap semiconductor gallium oxide materials, with technical parameters leading similar international products.

2. The Nanjing Special Gas Production Center project, invested by Baoying (Nanjing) Gas, has started construction, planning to establish Nanjing's first 8,000 tons/year ultra-high purity ammonia gas (optoelectronic grade) production center.

3. On May 31st, the $1 billion silicon nitride material project successfully signed and settled in Tongxiang, with an expected annual output value of $600 million after full production.

4. Relevant units in Hangzhou have issued documents, striving to achieve a scale of 40 billion yuan for the integrated circuit industry across the region by 2025.

5. Subsidiaries of TSMC and NXP Semiconductors plan to jointly invest $7.8 billion to build a chip factory in Singapore.

6. At the Taipei International Computer Show, MediaTek announced its move towards 2-nanometer process technology and exploration of advanced 2.5D and 3D packaging technologies to promote the development of hybrid AI computing.