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Home -News -Latest News -Nokia and Swiss Telecom have achieved a groundbreaking collaboration to build the world’s largest drone 5G network.

Nokia and Swiss Telecom have achieved a groundbreaking collaboration to build the world’s largest drone 5G network.

Release date:2024-08-12Author source:KinghelmViews:1218

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Source: SlkorMicro General Manager Song Shiqiang's WeChat Moments


International News

1. Technology giant Philips has announced the acquisition of 21 communication standard-essential patents from OPPO, aiming to enhance its communications technology development portfolio.

2. Tower Semiconductor will hold its 2024 Global Technology Symposium in Shanghai on September 24, 2024.

3. Samsung is set to mass-produce the 5nm AI chip DX-M1 for artificial intelligence semiconductor company DeepX.

4. Infineon has officially opened a new wafer fab in Malaysia, which, upon completion, will become the largest and most competitive 200mm silicon carbide power semiconductor wafer fab globally.

5. HP has denied reports about relocating half of its PC production out of China, calling them inaccurate.

6. Software manufacturer Anaconda has filed a lawsuit against Intel, accusing the latter of misusing its software to develop artificial intelligence platforms.

 

China News

1. Nokia and Swiss Telecom have achieved a groundbreaking collaboration to build the world’s largest drone 5G network.

2. SMIC’s revenue for the quarter reached $1.9013 billion, a substantial year-on-year increase of 21.8%, maintaining its position as the third-largest wafer foundry globally.

3. SlkorMicro (https://www.slkoric.com/) and Kinghelm's weekly star was SlkorMicro Sales Manager Yin Hao, who has been awarded 200 RMB.

4. TSMC’s U.S. wafer fab is facing two major issues: work culture conflicts and challenges in attracting the top 1% of talent due to salary constraints.

5. The Shanghai Stock Exchange has terminated the listing review of Silicon Valley Digital Semiconductor Co., Ltd. on the STAR Market.

6. Hua Hong Semiconductor's Q2 capacity utilization rate increased to 97.9%, with continued expansion in 12-inch wafer production.

 

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