International News

1.The US, EU, and UK have signed an AI standards agreement with the European Commission, marking the world’s first legally binding international AI convention.

2. Samsung Electronics has unveiled its future memory product roadmap, including the last generation of 10nm-class 1d nm technology by 2026, and the next-generation HBM4E, also set for release in 2026.

3. Shin-Etsu Chemical Industries has developed large substrates for manufacturing Gallium Nitride (GaN) semiconductors, with an area equivalent to silicon substrates, which can double production efficiency.

4. World Advanced (VIS) and NXP Semiconductors plan to start construction of a 12-inch wafer plant in Singapore later this year, with mass production expected to begin in 2027.

5. Kinghelm has launched its "kinghelm" high-speed signal connectors, plugs, and ports series, providing supporting services for large-scale applications in AI, big data, and more.

6. Intel will collaborate with Japan's AIST to establish an advanced semiconductor manufacturing equipment and materials R&D center in Japan, expected to be completed within 3-5 years.

China News

1. The National Integrated Circuit Industry Investment Fund Co., Ltd. has invested nearly 500 million yuan in Shenzhen Hongxin Micro-Nano Technology Co., Ltd., an EDA company.

2. TSMC plans to combine InFO-SoW with SoIC to form CoW-SoW, stacking memory or logic chips on wafers, with mass production anticipated to start in 2027.

3. Korean ASFLOW Semiconductor Equipment held a signing ceremony for its ultra-clean module and system integration project, with a total investment of $150 million.

4. Chip Alliance Integration has announced a proposal to acquire a 72.33% stake in Chip Alliance Yuezhou for 5.897 billion yuan, making it the largest semiconductor deal in A-shares this year.

5. Recently, Chip Investment Micro has completed the product process line for SAW filter wafer manufacturing and wafer-level packaging, establishing scalable and expandable SAW filter production capacity.

6. TSMC and Samsung Electronics have reached an agreement to jointly develop the next-generation buffer-less HBM4 chips. As the sixth generation of HBM chips, HBM4 has become a major focus for chip manufacturers.

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