Semiconductor Industry Updates

    1. KT Encourages Voluntary Employee Departures: South Korea's second-largest telecom company, KT, has raised its severance pay cap from 330 million KRW to 430 million KRW to encourage employees to leave voluntarily.

    2. AI Boosts Chip Market Growth: According to market research firm Gartner, the global semiconductor market is projected to grow by 18.8% in 2024, reaching $629.8 billion, driven by advancements in artificial intelligence.

    3. Rambus Reports Q3 Revenue Growth: Rambus CEO announced that the company’s third-quarter revenue reached $145.5 million, attributed to the launch of a new comprehensive chip set.

    4. Apple Wins Smartwatch Patent Case: Apple has won a patent case against Masimo, resulting in a $250 award.

    5. Infineon Unveils World's Thinnest Silicon Power Wafer: Infineon has introduced the world's thinnest silicon power wafer, measuring 30mm in diameter and just 20 microns thick—about a quarter the thickness of a human hair.

    6. US Government Imposes Tech Investment Restrictions: The US government has finalized restrictions on investments by individuals and companies in advanced technologies in China, primarily targeting semiconductors, quantum computing, and AI. The new rules will take effect on January 2.

China Semiconductor Updates

    1. BYD Surpasses Tesla in Q3 Revenue: BYD reported third-quarter revenue of 201.125 billion yuan, marking the first time it has outperformed Tesla in a single quarter.

    2. Alibaba Launches AI Business Assistant 2.0: Alibaba's international platform has officially launched its first full-process AI product, the AI Business Assistant 2.0.

    3. Chinese Supreme Court and Procuratorate Address IP Litigation: In a rare joint statement, China's Supreme People's Court and Supreme People's Procuratorate addressed the issue of malicious intellectual property lawsuits, signaling a crackdown on the "fishing for rights" black market.

    4. Laplace Semiconductor Equipment Manufacturer Goes Public: Semiconductor equipment manufacturer Laplace debuted on the Science and Technology Innovation Board, with shares soaring by 286.3% on its first day.

    5. New Vehicle Networking Resolution Passed: The China Academy of Information and Communications Technology, along with ZTE and China Mobile, has proposed a new resolution for vehicle networking, which has been approved by the World Telecommunication Standardization Assembly.

    6. TSMC Plans to Expand Advanced Packaging Capacity: TSMC is set to further acquire and expand production capacity in the advanced packaging sector by purchasing additional facilities from Innolux.

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