International Tech New:

1. Russia has received the first batch of 1,000 self-developed Baikal-S processors, the "Lake Baikal" chips, with 48 cores each!

2. Mitsubishi Electric plans to invest approximately 10 billion yen to build a new power semiconductor module packaging and testing factory, aiming to start operation in October 2026.

3. The South Korean government will provide over 14 trillion won in policy-based financing for the entire semiconductor sector, including materials, components, equipment, and fabless design enterprises, in 2025.

4. Microsoft, Hewlett-Packard, and Dell are stepping up efforts to stockpile as many Chinese-made electronic components as possible before January next year to cope with the situation of increased tariffs on Chinese goods after Donald Trump returns to the White House.

5. Slkor Micro (www.slkormicro.com) has released the design of its mascot "PowerBoy", which is now used for the AI intelligent customer service robot on its official website! The sales of Slkor Micro's products on the Digi-Key platform continue to show a good momentum.

6. The U.S. Department of Commerce will provide direct funding of up to $7.86 billion for Intel's commercial semiconductor manufacturing projects in accordance with the "CHIPS Act"!

Domestic Tech New:

1. The exposed court hearing record details the clash between Hao Yijin Wang Hansheng and Changsha Mituo, involving police calls, Yu Xiaohan's issues, and potential invalidation of Mituo's software copyrights.

2. The J2C plant for the 3D multi-chip integrated packaging project of SJ Semiconductor Co., Ltd. was successfully topped out.

3. Cambricon has increased its capital by 200 million yuan for its wholly-owned subsidiary in Shanghai, which will be used for the "General-purpose Intelligent Processor Technology Research and Development Project for Emerging Application Scenarios".

4. The second phase project of Changsha BYD Electronics has been officially put into production. The commissioning of this project is expected to increase the annual output of smart terminals by 10 million units.

5. Xiamen UMS Chips Co., Ltd. plans to conduct its initial public offering and list on the stock market. It is an important partner for global optical module manufacturers and system equipment suppliers.

6. The leading developer of fusion vision sensors, OmniVision®, announced the launch of its new-generation board-level development platform dedicated to fusion vision - APX EVK Gen2.

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