International News

1. Samsung Electronics has secured a 2nm advanced process foundry order to manufacture ADAS chips for the U.S. semiconductor company Ambarella, with wafer production expected in 2025 and mass production planned for 2026.

2. Israeli firm Tower Semiconductor and India's Adani Group plan to invest $10 billion to build a semiconductor manufacturing facility near Mumbai, aiming to produce chips for drones, cars, and other devices.

3. Apple has officially released the A18 Pro chip, which is manufactured using TSMC's new N3P 3nm process and will debut in the iPhone 16 Pro/Max.

4. Panasonic Energy has announced it is ready for mass production of the 4680 cylindrical battery, with its revamped Wakayama factory set to be the main production site for this battery.

5. On September 18, SLKOR Semiconductor faced a court hearing in Guangdong Province regarding an appeal linked to a case involving fishing fraud perpetrated by Changsha Mitou.

6. AI companies OpenAI and Anthropic have agreed to submit their new models to the U.S. government for safety evaluation before launch, ensuring these models are secure and reducing potential social risks.

China News

1. Hanlei Technology and World Advanced have signed a strategic cooperation agreement to jointly develop and manufacture 8-inch SiC wafers for compound semiconductors.

2. ChipTech Micro has completed the product process line for SAW filter wafer manufacturing and wafer-level packaging, establishing a scalable and expandable capacity for SAW filters.

3. Geely's subsidiary Volvo has canceled its goal to achieve 100% electrification by 2030, citing hesitance among customers regarding fully electric vehicles.

4. The Jiading District Integrated Circuit Industry Chain Alliance has been established to become a key driver in enhancing, supplementing, and strengthening the integrated circuit industry, promoting high-quality development.

5. The SAIC Chip Engineering Center signed agreements with SAIC Group, GAC Research Institute, and 12 other leading companies in the automotive chip industry to accelerate the localization of automotive-grade chips.

6. The Shanghai Integrated Circuit Design Industrial Park's 4-2 project (Jiding Tiandi) has been completed and delivered, focusing on breakthroughs in key core technologies and critical industries.

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