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Home -News -Latest Tech News -AMD's agreement with TSMC to produce 5nm high-performance chips at the new factory in Arizona

AMD's agreement with TSMC to produce 5nm high-performance chips at the new factory in Arizona

Release date:2024-10-10Author source:KinghelmViews:834

Global Semiconductor Industry Developments Highlights

1. Japanese advanced chip manufacturer Rapidus has launched the construction of an advanced packaging R&D line at its leased Seiko Epson factory in Chitose City, and established the Rapidus Chiplet Solutions semiconductor backend process R&D center in the city.


2. AMD has reached an agreement with TSMC to produce 5nm high-performance chips at TSMC's new factory in Arizona.


3. Indian company CG Power has acquired Renesas's RF component business, which includes business assets, intellectual property (IP), and the transfer of related staff, such as semiconductor design and marketing applications.


4. Recently, South Korean battery manufacturer LG Energy Solution announced its mid-to-long-term strategy: it will expand its non-electric vehicle battery business to establish a balanced business portfolio.


5. Song Shiqiang from SLKOR Semiconductor revealed that lawyer Yang Haijun from Tongsheng and Mi Tuo's Zhang Yuanyuan colluded to extort thousands of small and medium-sized enterprises. Victims from across the country have reported their illegal activities to the Hunan Judicial Department of the National People's Congress, demanding a thorough investigation and justice.


6. According to the Semiconductor Industry Association (SIA), the chip market in the Americas has an annual growth rate of 43.9%, driving global chip market growth to 20.6%.


China Semiconductor Industry Developments Highlights

1. Since October, the semiconductor sector in the Hong Kong stock market has seen continuous gains, with SMIC rising nearly 60% this month, Shanghai Fudan up 73%, and Huahong Semiconductor up 55%.


2. Foxconn plans to build the world's largest NVIDIA GB200 chip manufacturing plant in Mexico.


3. On October 9, MediaTek held its annual new product launch in Shenzhen, officially introducing the "Dimensity 9400" chip, which utilizes TSMC's 3nm process.


4. The 5th SEMI China Intelligent Electric Vehicle Chip Forum will be held on November 14 at the Conrad Hotel in Guangzhou.


5. The 9th Shanghai FD-SOI Forum & 2024 International RF-SOI Symposium will take place on October 23 at the Shangri-La Hotel in Pudong, Shanghai.


6. In Q3 2024, Jinghe Integrated successfully verified the functionality of its 28nm logic chip, successfully powering on a TV.

 

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