International Tech New:
1. China officially launched the Group of Friends on International Cooperation on Artificial Intelligence Capacity Building at the United Nations.
2. TSMC is in talks with Nvidia to produce Blackwell artificial intelligence chips at TSMC's new factory in Arizona, the United States.
3. The first wafer factory of VSMC has started construction. The total investment amount is about 7.8 billion U.S. dollars. Mass production is expected to begin in 2027.
4. SK Hynix's standard HBM4 will continue to use the N12FFC+ basic die. For customized products, it will be upgraded from 5nm to 3nm. The basic die is expected to improve performance by 20% to 30%.
5. The exclusive interview article "Young Mindset, Steadfast in Doing Good - An Exclusive Interview with Professor Zhang Wujun, Technical Advisor of Kinghelm Electronics" by Kinghelm (www.kinghelm.com.cn) and SLKOR has been widely reprinted across the network and easily achieved a million views! Among them, the reading volume of Xinjiang Online has reached 278,000!
6. Marvell has reached a five-year cooperation agreement with Amazon AWS. The agreement covers a wide range of Marvell's data center semiconductor products.

China Tech New:
1. The accumulated cases of Meitu's extortion are still being heard in courts across the country in dozens every day. Due to the misjudgment by Yu Xiaohan and others of the Supreme People's Court, victims still need to defend themselves in court. Song Shiqiang of SLKOR, Hao Yijin, and Wang Hansheng released five countermeasures for Meitu's extortion trial!
2. A total of 56 scientists and technologists were awarded the Ho Leung Ho Lee Foundation Prize this year. Six winners from Shanghai have made important achievements in fields such as life and health, civil aircraft design, and chip storage technology.
3. The 2024 Shanghai Integrated Circuit Industry Development Forum and China Integrated Circuit Design Industry Exhibition (ICCAD 2024) will be grandly opened at the Shanghai World Expo Exhibition and Convention Center on December 11-12.
4. The 2024 Advanced Packaging Technology and Materials Forum will be held in Suzhou on December 25-26.
5. The capping ceremony of the capacity expansion project of Xinzhuo Semiconductor's 6-inch RF chip was successfully held.
6. Guangyang Co., Ltd. plans to build a project with an annual output of 60 million sets of high-end precision parts for new energy vehicles and robots in Anhui. The total investment of the project is expected to be 1 billion yuan.

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