Global Semiconductor Industry Developments Highlights

1. At the Advancing AI 2024 conference in San Francisco, AMD introduced the Instinct MI325X AI accelerator, positioning itself as a direct competitor to Nvidia's Blackwell chip.

2. Intel has revised its shipping projections for the AI server chip Gaudi 3, reducing the expected quantity from 300,000–350,000 units in 2025 to a new range of 200,000–250,000 units, representing a decrease of over 30%.

3. Powerchip Semiconductor Corporation and Tata Electronics of India have finalized an agreement to construct India's first 12-inch wafer fabrication facility, with a total investment of $11 billion. This facility will support technology nodes from 28 to 110 nanometers.

4. Amkor Technology and TSMC have signed a memorandum of understanding aimed at enhancing advanced packaging and testing capabilities in Arizona, thereby expanding the semiconductor ecosystem in the region.

5. In legal news, Yang Haijun and his spouse Zhang Yuanyuan from Changsha Tongsheng Law Firm are under investigation by the Hunan judicial system for a series of extortion cases linked to Changsha MetInfo. Evidence was collected from Mr. Yu Xianyong, a victim from Jiangsu Nantong Bosu Pharmaceutical Technology Co., Ltd.

6. Foxconn is in the process of constructing the world's largest manufacturing plant for Nvidia's GB200 chip to meet the increasing demand for the Blackwell platform.

China Semiconductor Industry Developments Highlights

1. The Jiufengshan Laboratory in Hubei has successfully developed a heterogeneous integration technology that incorporates indium phosphide lasers into an 8-inch SOI wafer, a process known in the industry as "chip light emission."

2. Taiwan's long-established PCB manufacturer Jingguo plans to halt production at its Taiwan facility starting December 25, 2024, with future orders being redirected to its subsidiary, Jinglu Electronics, located in Kunshan, China.

3. During the launch event for new products, MediaTek unveiled the Dimensity 9400 alongside the world's first 3nm flagship automotive cockpit chip, the CT-X1, signaling its entry into the automotive sector.

4. BYD Company has announced a recall of 96,700 units of its Dolphin and Yuan PLUS electric vehicles, effective September 30, 2024.

5. NIO China has secured a capital injection of 3.3 billion yuan from state-owned shareholders, reflecting strong market confidence in the growth of China's intelligent electric vehicle industry.

6. TSMC's pricing for each 300mm 2nm wafer is projected to exceed $30,000, up from the previously estimated $25,000, indicating rising costs in cutting-edge semiconductor production.

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