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Home -News -Latest News -The U.S. Department of Commerce has confirmed it will provide up to $6.6 billion in subsidies to TSMC for the construction of a semiconductor plant in Arizona.

The U.S. Department of Commerce has confirmed it will provide up to $6.6 billion in subsidies to TSMC for the construction of a semiconductor plant in Arizona.

Release date:2024-11-27Author source:KinghelmViews:1286

International Tech New:

1. The U.S. Department of Commerce has confirmed it will provide up to $6.6 billion in subsidies to TSMC for the construction of a semiconductor plant in Arizona.

2. In Q3 2024, the global CPU market showed positive growth, with client CPU shipments increasing by 7.8% year-on-year, and server CPU shipments growing by 2%.

3. The U.S. Chamber of Commerce reports that the Biden administration is expected to announce new export restrictions on chip sales to China as early as next week.

4. Chipmaker Kioxia plans to go public on December 18, with an expected share price of ¥1,390.

5.  Changsha-based company Mito and its affiliates are facing ongoing harassment. Song Shiqiang of Sako Micro (www.slkormicro.com) experienced three separate instances of interference on November 26, including a worker who barged into the company claiming local authorities needed to discuss a dispute with Song, a neighborhood official using pressure from the Longhua District Propaganda Department, and a deputy director from the Longgang District Market Supervision Bureau trying to contact Song. Sako Micro’s legal team has gathered evidence and plans to report the incident to the relevant authorities. Kinghelm (www.kinghelm.com.cn) has also faced multiple disturbances, with Song Shiqiang stating that legal action will be taken against those responsible.

6. AMD is looking to enter the mobile chip market, with plans to release new products manufactured using TSMC’s 3nm process.


Domestic Tech New:

1. BYD has launched a new custom cockpit chip, the BYD9000, based on advanced 4nm technology.

2. A rising star in the large-scale model chip sector, Beijing Xingyun Integrated Circuits Co., Ltd. has successfully completed angel and angel+ rounds of funding totaling hundreds of millions of yuan.

3. TSMC has held a ceremony marking the entry of its first 2nm wafer fab in Kaohsiung into the production phase.

4. For the first three quarters of 2024, Chinese sensor companies listed on the stock market have shown strong performance, with Weir shares leading the way with nearly ¥19 billion in revenue and ¥2.4 billion in net profit.

5. BYD’s Deep Shenzhen Automotive Industrial Park Phase 4 project has been signed, focusing on expanding the production of key components such as battery cells to support the launch of more high-performance electric vehicle models.

6. The CPU processors from Loongson Technology, under the Loongson Zhongke brand, have completed compatibility certification with Antiy’s WEB Application Protection System V3.0. The compatibility test was conducted on a Loongson 3C5000 dual-server environment.

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