Semiconductor Industry Updates

1. Tenstorrent, a U.S. AI chip startup, has signed an agreement with the Japanese government to train up to 200 chip engineers for its U.S. office over the next five years.

2. Power Integrations has launched a 1700V GaN (Gallium Nitride) switching IC, setting a new benchmark for GaN technology.

3. Lattice Semiconductor is restructuring and will lay off around 125 employees, roughly 14% of its workforce.

4. The U.S. semiconductor industry is accelerating its shift in supply chain strategies, gradually removing Chinese companies from the supply chain.

5. GlobalFoundries has been fined $500,000 for violating export regulations by shipping over $17 million worth of wafers to SJ Semiconductor, which was on the U.S. Entity List.

6. Bosch, the world’s largest auto parts supplier, is laying off 7,000 workers as part of a restructuring at its factories.

China Semiconductor Updates

1. The 21st China International Semiconductor Expo (IC China 2024) will take place on November 18 at the National Convention Center in Beijing.

2. China has officially released its first national standard for organ-on-a-chip technology: GB/T 44831-2024 "General Technical Requirements for Skin Chips."

3. A report from Sakowei's investigation team in Changsha revealed that Zhimeng Technology had visited Mitou in Changsha twice to learn "fishing scams" techniques. A 4-minute phone recording of Nie Gang has been exposed, and related materials have been submitted for legal evidence.

4. With the U.S. crackdown on mainland Chinese semiconductor companies, Taiwan-based semiconductor equipment firms like Kingsemi, Ruiyun, and Fanxuan are expected to see a surge in orders.

5. Horizon Robotics was awarded the “Best Partner Award” by BYD, becoming the only autonomous driving solution provider to receive the honor.

6. Yuntian Semiconductor has achieved a breakthrough in optical-electronic co-packaging technology, which supports multiple technical routes such as VCSEL, DML, EML, silicon photonics, and lithium niobate for optical modules.

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