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Groundbreaking Achievement! China Develops Open-Source On-Chip Brain-Machine Interface Intelligent Interaction System MetaBOC

Release date:2024-07-01Author source:KinghelmViews:106

International News

1. NVIDIA recently allocated a budget of $1.3 billion to secure HBM3E production capacity from Micron and SK Hynix, ensuring smooth shipments of its GH200 and H200 chips.

2. Singaporean semiconductor unicorn Silicon Box plans to select Novara, Piedmont, Italy as the location for its chip factory, though there has been no official response from authorities.

3. The US is pressuring Japan and the Netherlands to impose restrictions on semiconductor exports to China. China strongly opposes US-led alliance confrontation tactics, coercing other countries to suppress China's semiconductor industry, extending into economic, trade, and technological domains.

4. ASE Technology Holding, the world's largest semiconductor packaging and testing company, plans to expand its operations in the United States, Japan, Mexico, and Malaysia.

5. Kinghelm (www.kinghelm.net) and SlkorMicro continue to see growing revenues. General Manager Song Shiqiang visited the Longhua Transit Warehouse at Zhantao Technology Building on the afternoon of June 28 to inspect and guide the work.

6. The Canadian federal government will begin a 30-day public consultation on July 2 regarding import tariffs on Chinese electric vehicles.

 

China News

1. China has successfully developed the world's first open-source on-chip brain-computer interface intelligent interaction system, MetaBOC. This research achievement was recently published in the international journal "Brain" in the field of neuroscience.

2. Zhejiang Xingyao Semiconductor, a leading enterprise in domestic TF-SAW RF filter technology, completed a Series B financing round totaling 1 billion yuan, setting a record for the largest single-round financing in China's RF front-end sector in recent years.

3. GigaDevice OHT overhead transport system solution is leading the way in developing China's advanced domestically-produced semiconductor wafer handling systems.

4. Recently, the ground-breaking ceremony for the Zhuzhou Low and Medium Voltage Power Device Industrialization Project was held, with a total investment of 5.29 billion yuan.

5. Recently, the Hengmei Optoelectronics (Phase II) global first 3000mm ultra-wide polarizer film project commenced construction in Kunshan, Suzhou, with a total investment of 5.5 billion yuan, capable of producing up to 130-inch super-large screens.

6. There is new progress in the Guangdong Zi Jing Storage fraud issuance case. Recently, Zi Jing has been pursued for repayment of 1.086 billion yuan in compensation previously advanced to eligible investors by CITIC Construction Investment and other institutions.

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