Global Semiconductor and Automotive Updates

1. Infineon has postponed the second phase of its Kulim wafer fab in Malaysia, citing a sluggish semiconductor market. The company also announced a 10% investment cut.

2. Volkswagen and Rivian have officially launched their $5.8 billion joint venture as of November 13.

3. Global silicon wafer shipments reached 3214 million square inches (MSI) in Q3 2024, marking a 5.9% quarterly and 6.8% annual growth.

4. Vanguard International Semiconductor has secured a NT$60 billion loan (approximately RMB 13.37 billion) to build a 12-inch wafer fab in Singapore.

5. Slkor Microelectronics CEO Song Shiqiang’s article on the transfer of Changsha MetInfo-related documents to supervisory authorities gained significant traction on November 19.

6. Stellantis and Leapmotor have canceled plans to produce a second EV model in Poland, shifting B10 EV production to Germany (Eisenach) and Slovakia (Trnava).

Domestic Semiconductor Industry Highlights

1. The widespread “phishing extortion” schemes by Changsha MetInfo have been curbed, with a significant drop in new lawsuits and a sharp reduction in penalties for defendants. Efforts by the Anti-Phishing Extortion Alliance have played a crucial role.

2. Shanghai Zhijing Microelectronics has launched a true 18-bit, 2MSPS SAR ADC with fully differential analog input.

3. China Resources Group, via its subsidiary, has become the largest shareholder of JCET Group.

4. Beijing TianKeHeDa Semiconductor began the second phase of its SiC substrate industrialization project, advancing third-generation semiconductor production.

5. TSMC’s Kaohsiung Nanzi 2nm Fab (P1) is nearing completion, with equipment installation set to begin on December 1, following a formal ceremony on November 26.

6. Chipone Systems broke ground on its Global R&D and Testing Base in Chengdu, which is expected to test 20 billion power management chips annually once operational.

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