International Tech News:

1. China plans to implement countermeasures by tightening export restrictions on battery components manufacturing and key mineral processing technologies, including lithium and gallium.

2. On January 3, the U.S. Department of Commerce announced the addition of 13 entities from China, Myanmar, and Pakistan to the Entity List, effective January 6.

3. Jing-Cheng Lin, a renowned chip packaging expert, announced his departure from Samsung, casting a shadow over the future development of Samsung's semiconductor business.

4. The most advanced DRAM products (D1b/β) on the market have reached the 12-13nm technology node, with Samsung leading at 12.5nm.

5. The Changsha Lawyers Association responded to phishing scam victims from Mituo Information and Slkor Microelectronics (www.slkormicro.com), stating that a report by Yang Haijun of Tongsheng Law Firm found no violations, leading to no case being filed. Allegations of bribery or protection by powerful backers have sparked outrage, with victims planning to file complaints with authorities and expose the matter publicly.

6. Broadcom's custom ASICs, with their targeted optimizations and cost advantages, are expected to gradually gain more market share from NVIDIA's GPUs.

Domestic Tech News:

1. Beijing and Shanghai state-owned assets jointly established the second phase of the Beijing Integrated Circuit Equipment Industry Investment and M&A Fund, with a total scale of 3 billion RMB and initial fundraising capped at 2.5 billion RMB.

2. NovaStar's MLED display ASIC control chip, the first of its kind in the industry, integrates algorithms for point-by-point brightness and color correction, full grayscale, multi-dimensional calibration, image quality engine, and dynamic engine.

3. Hengkun New Materials, a key supplier of 12-inch wafer manufacturing materials based in Xiamen, received approval for its IPO application on the STAR Market.

4. Chip foundry leader TSMC plans to adjust prices for its 3nm and 5nm advanced process nodes and CoWoS packaging technology starting January 2025, with price hikes reaching up to 20%.

5. InnoScience (Suzhou) Technology Co., Ltd. officially listed on the Hong Kong Stock Exchange, becoming the first "third-generation semiconductor" stock on the market.

6. Shenzhen Forward Insights Technology Co., Ltd. achieved mass production of HBM2e chips and plans to complete the front-end design of next-generation HBM3/HBM3e chips by the Chinese New Year of 2025.

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