International Tech News:

1. Applied Materials Inc., the largest chip equipment manufacturer in the U.S., has a cautious outlook on its revenue forecast for the current quarter due to the risk of export controls potentially affecting its business.

2. Infineon has made significant progress on its 8-inch Silicon Carbide (SiC) technology roadmap, with the first devices based on 8-inch SiC wafers expected to be delivered to customers in the first quarter of 2025.

3. The U.S. government may be pushing for a plan to facilitate a joint venture between chip makers Intel and TSMC.

4. SK Hynix is reviewing the applicability of the Chinese EDA software it uses. It is expected that during Trump's second term, restrictions will be imposed on South Korean companies' use of Chinese software.

5. On February 15th, the "Kinghelm Cup" (www.kinghelm.com.cn) 2025 Songgang Factory BA Zhongqing Spring Basketball League kicked off! Kinghelm Sales Director Deng Haifeng, Chen Suwei, and others attended the opening ceremony.

6. NVIDIA is collaborating with MediaTek to re-enter the smartphone chip market. The two companies plan to launch a mobile SoC integrated with advanced AI capabilities to challenge the existing market structure.

Domestic Tech News:

1. TSMC's board of directors has approved a capital increase of up to $10 billion (RMB 72.945 billion) to fully acquire its subsidiary TSMC Global, a massive amount that has attracted market attention.

2. Guangzhou held a major project groundbreaking event for the first quarter of 2025, with a total of 341 projects breaking ground, including the production and R&D base project for Lingen Vision, a subsidiary of Jinko Electronics, in the Greater Bay Area.

3. Shanghai Silicon Industry will sign a framework agreement for the purchase of electronic-grade polycrystalline silicon with supplier Xinhua Semiconductor, with the total contract value expected to reach RMB 1.054 billion (including tax).

4. The "Zhongguancun Science City Integrated Circuit Tape-Out Subsidy Application Guide" has been officially released, with the maximum reward amount for a single enterprise this year not exceeding RMB 15 million.

5. AU Optronics will end its solar monocrystalline wafer business this year, retaining only its semiconductor-related businesses, which will be integrated into its Taichung plant.

6. TSMC has planned to build three wafer fabs in Kaohsiung, with P1 and P2 to produce 2nm process chips, and P3 to produce 2nm or more advanced process chips.

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