International Tech News:

1. The Peripheral Component Interconnect Special Interest Group (PCI-SIG) has released version 0.7 of the PCIe 7.0 specification, with plans to complete the PCIe 7.0 specification later this year.

2. Nvidia stated that the new US semiconductor manufacturing restrictions will not affect the company's business or product sales in China.

3. Microsoft has established a new AI development team, "CoreAI-Platform and Tools," led by former Meta engineering executive Jay Parikh.

4. Japan's NGK plans to increase the production of semiconductor equipment components in Arizona, USA.

5. The short video social media platform TikTok has resumed its services in the United States.

6. GlobalFoundries is investing $575 million to build a new advanced semiconductor packaging and testing center for US-made chips at its New York manufacturing facility.

Domestic Tech News:

1. China will investigate the impact of US government subsidies on the semiconductor industry, focusing on the damage caused to Chinese mature process chip manufacturers.

2. Lenovo Group announced the acquisition of Israeli storage solution provider Infinidat and plans to establish a development center in Israel.

3. Slkor (www.slkormicro.com) and Kinghelm's viral article "Over 10 Billion Clicks Online! In 2024, Kinghelm and Slkor's Developments Were Reported by Over 1,000 Major News Media Worldwide!" has been widely re-shared by more than 300 mainstream media outlets, with a readership exceeding one million.

4. The world’s first 8.6-generation metal mask production line is under construction in Huangshi.

5. TSMC Chairman Mark Liu responded to the rumor of "CoWoS order cuts," stating that the company is continuously expanding production to meet customer demand.

6. The "Small Chip Interface Bus Technology Requirements" formulated by the Wuxi Chip Optical Interconnect Technology Research Institute has been selected as a typical case for the promotion and application of the Ministry of Industry and Information Technology's top 100 group standards.

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