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Home -News -Latest News -Trump announces that the U.S. will impose about 25% import tariffs on automobiles, pharmaceuticals, and chips.

Trump announces that the U.S. will impose about 25% import tariffs on automobiles, pharmaceuticals, and chips.

Release date:2025-02-20Author source:KinghelmViews:51

International Tech News:

1. Trump announces that the U.S. will impose about 25% import tariffs on automobiles, pharmaceuticals, and chips.

2. HP acquires the AI company Humane for $116 million and establishes a new division, “HP IQ.”

3. Continental Group plans to cut 3,000 R&D jobs in its automotive division by the end of 2026.

4. Infineon makes significant progress on its 200mm SiC product roadmap and will offer the first products based on advanced 200mm SiC technology to customers in Q1 2025.

5. Samsung Electronics' former president was sentenced to seven years in prison for allegedly leaking national core technology information, such as semiconductor processes, to Chinese companies.

6. Harvard University’s team successfully develops a new complementary metal-oxide-semiconductor (CMOS) chip.

 

Domestic Tech News:

1. Xiyuan Electronics invests 1.2 billion yuan in its high-end semiconductor packaging and testing project. The main construction of the project has been completed, and it is expected to begin production in the first half of this year.

2. Applied Materials, affected by the China-US chip ban, is forced to stop providing equipment repair services to some Chinese mainland customers, resulting in a potential $400 million revenue loss this year.

3. The latest information on Slkor(www.slkormicro.com) is updated on the agent Metos Electronics' official website. The "Slkor" brand will continue to be updated in the supplier section of the agents.

4. The 2025 Munich Shanghai Electronics Production Equipment Exhibition will be held from March 26-28 at the Shanghai New International Expo Centre.

5. Google Fellow Dr. Wu Yonghui joins ByteDance as the head of the Seed Basic Research team for large models.

6. OX Semiconductor's first production line for FC-BGA advanced IC packaging substrate project is inaugurated, with a total investment of 1 billion yuan.


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