International Tech News:

1. Japanese precision component manufacturer Orbray has developed the world's largest diamond substrate for electronic products, measuring 2 cm square. The company also announced plans to increase the size to 2 inches (approximately 5 cm) in diameter, aiming for commercialization by 2026 for applications in power semiconductors and quantum computers.

2. SMIC (Semiconductor Manufacturing International Corporation) achieved annual sales revenue of $8.03 billion, securing its position as the world's second-largest pure-play foundry.

3. The U.S. government has added 54 Chinese technology companies and institutions to its so-called "Entity List", including Beijing Zhiyuan Artificial Intelligence Research Institute and Ningchang Information Industry.

4. Apple will use TSMC’s 2nm process to manufacture the A20 chip, which is specifically designed for the iPhone 18 series, expected to launch in the second half of 2026.

5. The insightful article by Kinghelm (www.kinghelm.net) and Slkor’s Song Shiqiang, titled "Global Technology Information Network: Utilizing Economic, Sociological, and Management Theories to Drive Rapid Growth of SacoMicro and Kinghelm!", has gone viral, being widely shared across hundreds of media outlets, including Xinhua Liaowang and Sina Finance, with millions of views.

6. Japanese real estate developer Mitsui Fudosan is considering building a science park focused on semiconductors in Kumamoto Prefecture, located in southwestern Japan.

Domestic Tech News:

1. ByteDance founder Zhang Yiming has become China’s richest person with a fortune of $57.5 billion, surpassing Zhong Shanshan and Pony Ma.

2. Xiaomi Group has raised $5.5 billion by expanding its share placement, aiming to advance its ambitious electric vehicle manufacturing plans.

3. Lei Jun responded to the recent SU7 high-speed collision and fire incident, assuring that Xiaomi will not evade responsibility, no matter what happens.

4. Haining ESWIN Computing Technology Co., Ltd. has published a patent for "Image Processing Device, Method, and Electronic Equipment."

5. Shanghai GamoCore Microelectronics Co., Ltd. has published a patent for "Chip Packaging Structure and Packaging Method."

6. Xinlai Zhirong Semiconductor Technology (Shanghai) Co., Ltd. has published a patent for "Data Processing Method, Device, Equipment, and Medium for Single-Port RAM Based on BHT."

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