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Home -News -Latest News -On March 12, 2025, Intel announced that its board of directors has appointed Liwu Chen as Chief Executive Officer

On March 12, 2025, Intel announced that its board of directors has appointed Liwu Chen as Chief Executive Officer

Release date:2025-03-14Author source:KinghelmViews:42

International Tech News:

1. On March 12, 2025, Intel announced that its board of directors has appointed Liwu Chen as Chief Executive Officer.

2. Texas Instruments introduced a miniature MCU measuring just 1.38 square millimeters at Embedded World 2025, with a bulk purchase price of only $0.20 per unit.

3. Led by Germany, nine European countries announced the formation of a "Semiconductor Alliance" on March 12.

4. NXP Semiconductors unveiled the next-generation S32K5 series MCU for automotive applicationsthe industrys first 16nm FinFET MCU with embedded MRAM.

5. Swedish battery manufacturer Northvolt has filed for bankruptcy in Sweden due to cash depletion.

6. Škoda, a Czech automaker under Volkswagen Group, plans to lay off 8,200 employees as part of its cost management strategy related to the transition to electric vehicles.

 

Domestic Tech News:

1. Industrial and Commercial Bank of China (ICBC) will establish an 80 billion RMB Technology Innovation Fund to support the development of industries such as semiconductors.

2. AMEC (Advanced Micro-Fabrication Equipment Inc. China) has shipped a total of over 5,000 plasma etching reactors worldwide.

3. Kinghelm(www.kinghelm.net) and Slkor (www.slkormicro.com) are once again recruiting global agents and distributors in 2025, marking a solid step toward international market expansion.

4. Chongqing San'an'8-inch silicon carbide (SiC) substrate production line has entered operation, currently achieving a capacity of 500 wafers per week.

5. Chipower Micro'advanced packaging and testing facility has received its first lithography machine, paving the way for the completion of its first production line and gradual mass production. Once fully operational, the plant is expected to achieve an annual testing and packaging capacity of 120,000 wafers.

6. Qinghe Crystal has unveiled the world's first independently developed C2W & W2W dual-mode hybrid bonding equipment.

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