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Home -News -Latest News -Oracle has signed a multi-billion-dollar agreement with AMD to build an AI cluster featuring 30,000 MI355X chips

Oracle has signed a multi-billion-dollar agreement with AMD to build an AI cluster featuring 30,000 MI355X chips

Release date:2025-03-25Author source:KinghelmViews:4287

International Tech News:

1. The top 10 chip design companies recorded a total revenue of $249.8 billion in 2024, marking a 49% year-over-year increase. Among them, NVIDIA saw a remarkable 125% growth, significantly outpacing other manufacturers.

2. Oracle has signed a multi-billion-dollar agreement with AMD to build an AI cluster featuring 30,000 MI355X chips.

3. Samsung has shifted its R&D focus to its next-generation flagship chip platform, the Exynos 2600.

4. SoftBank Group, the parent company of Arm, will acquire full ownership of Ampere for $6.5 billion (approximately 973 billion yen).

5. Kinghelm (www.kinghelm.net) / Slkor has received shipments of promotional materials, including document bags, Bluetooth headsets, and handheld fans, for the Munich Shanghai Electronics Exhibition. Preparations for the event are progressing smoothly, and we look forward to meeting you in Shanghai this April!

6. The U.S. has asked Malaysia to closely monitor the movement of high-end NVIDIA AI chips entering the country, as Washington suspects that many of these chips are ultimately being rerouted to China.

 

Domestic Tech News:

1. The top 10 domestic AI chips used in DeepSeek’s all-in-one machine are Kunlunxin, Huawei Ascend, Hygon, Muxi, Tianshu Zhixin, Moore Threads, Sunway, Biren, Intellifusion, and Jingjia Micro.

2. TSMC has started trial production of its 2nm process technology, with an initial yield rate of 60%. Mass production is expected to begin in the second half of 2025.

3. The key technology R&D project for automotive-grade microcontroller chips, a major initiative by AMEC (Advanced Micro-Fabrication Equipment Inc.) in Shenzhen, is still under development.

4. Silicon Power Semiconductor Equipment (Shenzhen) Co., Ltd. has successfully listed on the ChiNext board.

5. The high-temperature superconducting silicon single-crystal equipment and crystal production project has officially broken ground in the Yinchuan Economic and Technological Development Zone, with a total investment of 10 billion yuan.

6. Shanghai Super Silicon, a leading semiconductor wafer manufacturer, has completed its IPO counseling process.

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