International Tech News:

1. Vietnam's first chip manufacturing project has a considerable funding scale, with 30% of the funding supported by the central budget, up to 10,000 billion VND (about 400 million USD), and the total investment could range from 1.2 billion to 1.6 billion USD.

2. A Chinese research team has made significant progress in the field of wide-bandgap semiconductor optoelectronic detection, successfully developing a gallium oxide blind photodetector with ultra-fast and highly sensitive responses.

3. Mizuho Securities believes that major AI restrictions are about to be introduced, such as the "complete ban on all AI chips entering China, impacting products including Nvidia's H20/B20 and some traditional chips (28nm+)."

4. Apple is developing a highly integrated Wi-Fi and Bluetooth chip, intended for use in the new Apple TV and HomePod mini models.

5. SLKOR Semiconductor (www.slkoric.com) has been awarded the "2024 Excellent Domestic Brand Enterprise" award by Huaqiang Electronics Network. General Manager Song Shiqiang and Deputy General Manager He Junju will attend the award ceremony on April 11.

6. Trump announced that TSMC plans to invest at least 100 billion USD in chip manufacturing facilities in the United States over the next few years.

Domestic Tech News:

1. The Lipus automotive-grade third-generation power semiconductor module project has started, with a total investment of 1 billion CNY. Once completed, the project will have an annual production capacity of 3 million automotive-grade SiC modules.

2. Quanzhou's first chip packaging and testing project, the Quanxin Micro Integrated Circuit Packaging and Testing Project, is expected to complete the debugging of part of the production line in April this year and begin trial production.

3. The first phase of the Dehua Chip Headquarters Base Project, covering 30 acres of industrial land, has successfully completed the land transfer. The total investment in the project is 1 billion CNY, with the first phase investment at 500 million CNY.

4. The Kewei Chuangxin Integrated Circuit Packaging and Testing Project has commenced, with a total investment of 1 billion CNY.

5. The Youyue Electronics Headquarters Project and Optoelectronic Semiconductor R&D and Manufacturing Base have started construction. The project will include the development of intelligent production workshops, an autonomous vehicle laboratory, and an optoelectronic semiconductor R&D center.

6. The 8-inch silicon carbide (SiC) power device chip manufacturing production line project of Xiamen Silan Microelectronics Co., Ltd. has officially topped out. The total investment in this project is 12 billion CNY.

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