●1.0mm pitch for high-density connections
●30-pin configuration supports multiple signals
●H2.0 surface mount design for easy assembly
●Front-in, back-flip structure optimizes space
●QCHF design enhances connection stability

Product Benefits

●Saves space, ideal for compact electronic devices
●Provides stable electrical connections, reducing signal loss
●Facilitates SMT installation, boosting production efficiency
●Flexible design adapts to various layout requirements
●Made from quality materials for long-lasting performance

Product Application

●Used in smartphones for display connections
●Ideal for tablets linking internal components
●Common in wearable devices for sensor integration
●Applied in automotive electronics for reliable connections
●Utilized in medical equipment requiring precise signal transmission
●Suitable for industrial control systems needing high-density connections