In the field of smart wearable devices, storage demands are increasing with the diversification and smartification of devices. Qi Kaitai, Vice President of Kowin Semiconductor, points out that the wearable market's demand for storage products is shifting towards small size, low power consumption, large capacity, and high performance. Kowin Semiconductor is addressing these needs by horizontally expanding its product line with eMMC, ePOP, UFS, and eMCP to meet various performance requirements, while vertically integrating production and packaging capabilities to enhance competitiveness.

The rise of AI is further driving the development of wearable devices. In 2024, AI features are starting to appear in smartwatches, headphones, and other wearable products, providing more natural interactions and more efficient operations. IDC predicts that global wearable device shipments will reach 559.7 million units in 2024, with the market continuing to grow. Canalys highlights that AI-driven and health monitoring features are key growth factors.

Kowin Semiconductor's products include small-sized eMMC, ePOP, eMCP, and UFS, catering to different application scenarios. For example, small-sized eMMC helps reduce device size, while ePOP is suited for high-end wearable products. The company is also actively strengthening its industrial chain integration, enhancing its overall competitiveness through improved packaging and testing capabilities. Kowin Semiconductor collaborates closely with customers, offering customized services to boost product competitiveness.

The trend towards localization presents new opportunities, particularly in the industrial control sector. Kowin Semiconductor responds to localization demands by offering industrial-grade eMMC and LPDDR products. Overall, the storage market for smart wearable devices is moving towards diversification and intelligence, posing new challenges and requirements for storage products.